[Federal Register Volume 63, Number 188 (Tuesday, September 29, 1998)]
[Notices]
[Pages 51957-51958]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 98-26049]


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DEPARTMENT OF JUSTICE

Antitrust Division


Notice Pursuant to the National Cooperative Research and 
Production Act of 1993--Universal Instruments Corporation 
(``Universal'')

    Notice is hereby given that, on March 20, 1998, pursuant to Section 
6(a) of the National Cooperative Research and Production Act of 1993, 
15 U.S.C. 4301 et seq. (``the Act''), Universal Instruments Corporation 
(``Universal'') has filed written notifications simultaneously with the 
Attorney General and the Federal Trade Commission disclosing (1) the 
identities of the parties and (2) the nature and objectives of the 
venture. The notifications were filed for the purpose of invoking the 
Act's provisions limiting the recovery of antitrust plaintiffs to 
actual damages under specified circumstances. Pursuant to Section 6(b) 
of the Act, the identities of the parties are Universal Instruments 
Corporation, Binghamton, NY; Allen-Bradley Co., Inc., Mayfield Hts., 
OH; AMKOR Electronics Inc., Chandler, AZ; Cabletron Systems Inc., 
Rochester, NY; Flip Chip Technologies, Phoenix, AZ; Digital Equipment 
Corporation, Hudson, MA; Eastman Kodak Company, Rochester, NY; ERICSSON 
RADIO SYSTEMS AB, Stockholm, SWEDEN; Heller Industries, Florham Park, 
NJ; IBM Corporation, Endicott, NY; Kester

[[Page 51958]]

Solder Div., Litton Systems, Inc., DesPlaines, IL; LSI Logic, Milpitas, 
CA; Nokia Mobile Phones, Ltd., Salo, FINLAND; Philips Consumer 
Communications, LeMans, FRANCE; Photo Stencil, Colorado Springs, CO; 
Robert Bosch GmbH, Stuttgart, GERMANY; VLSI Corporation, San Jose, CA; 
SGS-Thomson Microelectronics, Inc., Carrollton, TX; and Plexus 
Corporation, Neenah, WI. The nature and objectives of the venture are 
to acquire an in-depth understanding of all the material interactions 
and process limitations affecting Chip Size Packaging (``CSP'') and 
Direct Chip Attach (``DCA'') technologies which can be used to produce 
high quality products at high yields in the electronics industry. The 
overall objective of the venture is to provide fully documented 
processes which can be used to produce high quality product at high 
yields.
Constance K. Robinson,
Director of Operations Antitrust Division.
[FR Doc. 98-26049 Filed 9-28-98; 8:45 am]
BILLING CODE 4410-11-M